NXP, the independent semiconductor company founded by Philips, and
STMicroelectronics announced that their new joint venture name will be
ST-NXP Wireless. Created from the mobile and wireless businesses of
STMicroelectronics and NXP, which together generated $3 billion USD in
revenue in 2007, the new company will begin operations in a strong
position to meet customer needs in 2G, 2.5G, 3G, multimedia,
connectivity and all future wireless technologies. ST-NXP Wireless is
expected to enter the market in number three position once full closure
of the joint venture takes place, as scheduled, in the third quarter of
2008.
It was also announced today that the management team of ST-NXP Wireless
will comprise experienced industry leaders from both parent companies.
Alain Dutheil, presently chief operating officer (COO) of
STMicroelectronics, has been assigned to lead ST-NXP Wireless as Chief
Executive Officer (CEO) focusing exclusively on the new joint venture.
The Executive Committee of ST-NXP Wireless, led by Alain Dutheil, will include:
- Abhijit Bhattacharya, currently financial controller,
Multimarket Semiconductors Business Unit, NXP, who is nominated
to take the position of Chief Financial Officer of the joint venture
- Tommi
Uhari, current executive vice president and general manager of Mobile,
Multimedia & Communications Group, STMicroelectronics
- Marc Cetto, current executive vice president and general manager of Mobile & Personal Business Unit, NXP.
“The new name, ST-NXP Wireless, clearly illustrates the joining
together of two complementary and formidable forces in the worldwide
market to create a new global wireless powerhouse,” commented
Alain Dutheil, designated CEO, ST-NXP Wireless. “Our new company
will be uniquely positioned to continue and extend customer
relationships with the key players in the mobile and wireless industry,
leveraging the passion and expertise of what is one of the best pools
of talents in the industry.”
ST-NXP Wireless will be among the few companies with the scale to make
the R&D investments necessary to deliver current and future
wireless technologies. The joint-venture will combine key design, sales
and marketing, and back-end manufacturing assets from both parent
companies into a streamlined organisation that will rely on its parent
companies and foundries for wafer fabrication services. ST-NXP Wireless
will be headquartered in Switzerland. Aiming to close in Q3 2008, the
deal is subject to regulatory approvals and labor council consultation.
Some of the statements contained in this release that are not
historical facts are statements of future expectations and other
forward-looking statements (within the meaning of Section 27A of the
Securities Act of 1933 or Section 21E of the Securities Exchange Act of
1934, each as amended) based on management’s current views and
assumptions and involve known and unknown risks and uncertainties that
could cause actual results, performance or events to differ materially
from those in such statements.
Such forward-looking statements are subject to various risks and
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“believes”, “may”, “will”,
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“anticipates” or similar expressions or the negative
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forth and are discussed in more detail in “Item 3. Key
Information – Risk Factors” included in our Annual Report
on Form 20-F for the year ended December 31, 2007, as filed with the
SEC on March 3, 2008. Should one or more of these risks or
uncertainties materialize, or should underlying assumptions prove
incorrect, actual results may vary materially from those described in
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