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VDMA category ANALYSIS-MARKET-TRENDS - VDMA - electronics production
Electronics production equipment manufacturers expect turnover plus of five percent for 2008

For 2008 the German manufacturers of machinery and plants for electronics production still expect a turnover plus of five percent compared to last year. However, a general decrease in the total order value slows down the expectations to 2 percent growth for 2009. go

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Messe München GmbH
Messe München GmbH
category PRODUCT INNOVATIONS
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Messe München GmbH
Messe München GmbH
Olympus - semiconductor wafer inspection
Wafer inspection systems with automated wafer loaders go
DEK Solar - thin-film substrates
Photovoltaic metallization platform for the thin-film generation go
Siemens Industry Automation Division
New laser scanners safeguard small protection zones and transfer carriages go
Novatec -production process traceability
Sophisticated PCBA traceability to SMEs go
Essemtec - controlling software
New software for pick & place machines go
Interconnect Devices - interconnect solutions
Contact for QFN testing go
Siemens Division Industry Automation
Compact UHF readers for production and production-related logistics go
Skyray XRF - measurement system
X-ray fluorescence instrument for measuring plating thickness go
JTAG Technologies - scan module
Digital I/O scan module ideal for implementing boundary-scan and functional tests go
Baumer Electric - compact drives
Fast and Reliable Positioning go
Vitronics Soltec - good soldering results
Closed-loop preheater control ensures linear ramp profile, precise selective soldering control go
Essemtec - inline pick&place
New Pick & Place for 3D-MID go
MSD - Superdry
New generation MSD control cabinets go
Laser 2000 - Inkjet Printing System
Higher flexibility with inkjet printing systems for ophthalmic lens manufacturers go
Weiss Umwelttechnik - temperature and climate test chambers
The climate under control go
Manncorp - solder dipping system
Lead-free solder dipping system replaces manual methods go
Aster Technologies - coverage analysis tools
New generation of "easy to use" test coverage analysis tool go
JTAG Technologies
Digital I/O scan module ideal for implementing boundary-scan and functional tests go
Essemtec - SMD-silicone keys
Automatic SMD insertion of silicone keys go
Momentive - prepolymers
Prepolymers offer high tensile strength for next-generation structural adhesives go
IMS CHIPS and Robert Bosch
Contract to jointly develop and commercialize a fabrication process for ultra-thin chips go
Provertha - multi-sensor measurement system
3D video multi-sensor measurement technology for the manufacturing of precision plastic parts go
OKW Gehäusesysteme - cases
Small cases - attractive to carry go
Hover-Davis - auto­matic labeler
LPFN preprinted label feeder for Fuji go
SMAC - Moving Coil Actuator
Precision long life actuators for PCB assembly go
bedra - coated EDM wires
New coated EDM wires for higher cutting speeds go
Aerotech - galvo scanning head
Synchronised scanner extends the field of view for scanning head laser systems go
PA&E - Aluminum Silicon Carbide heat sink
AlSiC heat sinks offer reduced weight and improved thermal conductivity go
Indium Corporation - solder paste technology
First Rosin-Free, No-Clean, Cored Wire Solder go
Ziptronic direkt bond interconnect technology
Low temperature process employs nickel for reliable bonding without compression go
OK International - Soldering and Rework System
New soldering and rework systems increase production throughput and assure precision control go
Weidmüller - electronics housing system
Modular electronics housing system provides a home for individual electronics solutions go
Dual lane platform
DEK boosts throughput and flexibility with new Dual Lane RTC platform go
Vitronics Soltec - Precise Soldering Control
Selective Soldering System now features a wave height measurement system go
Alltec - fiber laser markers
New fiber laser marker family features the most compact design for unrivalled versatility go
Rittal at electronica 2008 - new subrack
Fast assembly, mechanical stability and simple handling go
Kulicke & Soffa - hub dicing blades
New series of hub dicing blades go
Binder - climatic chambers
New series of climatic chambers for constant conditions go
Manncorp - solder machine
Lead-free wave solder machine offers big performance in small space go
RPS - selective soldering systems
New selective soldering system delivers industries largest capacity native selective soldering range  go
Veeco - Web Coating Systems
New high throughput web coating platform for production of flexible thin film solar cells go
APS Novastar - Vision Control
Automated vision control for pick and place systems go
Pixargus - complete inspection of tubing surface
First-ever optical inline inspection of transparent tubing go
Rittal - 60-mm busbar system
First busbar system with "cULus-listed" approval go
Newport - thin film photovoltaic laser scribing systems
High throughput thin film photovoltaic laser scribing system go
Yxlon - at electronica 2008
Tape and reel inspection solution go
DEPRAG Schulz - Micro-Assembly-System
Assembly in the smallest of work areas go
Newport - laser scribing system
Thin film photovoltaic laser Scribing system go
J. Schmalz - Needle grippers
Needle grippers work where vacuum fails go
Novatec - production control tools
New suite of production control tools offering track and trace capabilities go
IPTE - Pin Insertion Machine
New innovative standards in press-fit technology go
KLA-Tencor - wafer inspection system
New monitor-wafer inspection system for the integrated circuit market go
Viscom - system for automatic wire bond inspection
Inspecting extremely small wire diameters at high speeds is now possible with wire bond AOI system go
Fexible SMD assembly system
Essemtec shows pick&place system FLX2011 at Electronica 2008 go
OK International - soldering system
Soldering system with enhanced thermal control go
Essemtec - stencil printer
Semi-automated paste printer features for vision system go
Aqueous Technologies
New automatic defluxing and cleanliness testing system go
RHE Microsystems - thermal management
Thick copper layer using thin film technology go
DEK - 2D Inspection
Software tool with 2D Inspection control go
IPTE - test cell
New test cell enables exact verification of objects to be tested with high pneumatic and hydraulic pressures in real-time go
Finetech - Contactless solder removal solutions
Solder removal head for contactless residual solder removal at large components go
DuPont Microcircuit Materials
Forward-looking technology in automotive electronic ceramic circuits using thick film compositions  go
Fritsch - standalone operation, batch system, inline system
For our automatic Pick&Placer - different feeding concepts for circuit boards go
Messe München GmbH
Messe München GmbH
category ANALYSIS-MARKET-TRENDS
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Messe München GmbH
Messe München GmbH
SEMI Silicon Manufacturers Group (SMG)
Silcon wafer shipments contract in third quarter 2008 go
SEMI - book-to-bill
North American semiconductor equipment industry posts september 2008 Book-to-Bill Ratio of 0.76 go
According to iSuppli:
Electronics contract manufacturing business to stay afloat during recession go
Messe München GmbH
Messe München GmbH
category NEWS
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Messe München GmbH
Messe München GmbH
Metal-free MID technology
New compound: Laser produces electrically conductive structures go
3D-SIC technology
IMEC demonstrates 3D stacked integrated circuits go
Fraunhofer ISE
39.7% – New European Record Efficiency for Solar Cells go
Messe München GmbH
Messe München GmbH
category APPLICATIONS
Messe München GmbH
Messe München GmbH
Pixargus - optical inline inspection system
Complete surface inspection of cables go