PRODUCT INNOVATIONS
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Lime Microsystems - transceiver IC
New single chip multi-standard transceiver
Following the successful launch of its 2-4 GHz MicroTCA transceiver
platform Lime Microsystems has achieved a single chip multi-band
multi-standard reconfigurable transceiver IC. The first test chips back
from the foundry have been tested and meet the original requirement for
a highly frequency agile transceiver IC, operating from 375MHz to 4GHz.
Sending and receiving data has been demonstrated successfully in each
of the vital frequency bands required for WiMAX, 3G and LTE operation,
paving the way for the adoption of Lime’s multi-standard
transceiver architecture in small cell base stations.
The transceiver and its associated reference design can be digitally
configured to operate the required frequency bands, with 16
user-selectable bandwidths from 1.5MHz to 28MHz. This means it can
transmit and receive data across all WiMAX bands (including those used
in different geographical areas), as well as those used for W-CDMA and
HSPA, and those that are planned for LTE. This removes the need for
individual transceiver chips for each of the different bands, and
allows a small cell base station to be reconfigured rapidly and simply.
The resulting reduction in bill of materials minimises costs and
inventory for OEMs.
The transceiver IC is presently undergoing an evaluation phase, where
selected key customers are consulted for feedback on the specification
of the design. The final chip design can then be fine-tuned to
incorporate their specific requirements, before ramping up to full
production quantities.
"We are very excited to have achieved success across the board at the
first silicon stage," comments Ebrahim Bushehri, CEO of Lime
Microsystems. "The current evaluation phase is essential, for two
reasons. Firstly, it gives us a chance to optimise the design according
our customers’ requirements. This means our offering will meet
their needs exactly, with a fully optimised and cost reduced solution.
Secondly, it allows selected customers to get a heads up on what our
chip can do, so they can begin integrating it into future femtocell
designs. We expect to be sampling the optimised design to the rest of
the market during Q4 this year.”
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