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Jet-Dosiertechnologie für Kapillar-Underfiller 70 category PRODUCT INNOVATIONS - Essemtec - Kapillar-Underfiller
Jet dispensing technology for capillary underfiller

Capillary underfiller gained more and more in importance during recent years. The increased use of BGA and flip chip components, improved underfill materials and the use of high precision dispensing systems led from an everyday physical effect to a reproducible high tech process. go

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Messe München GmbH
Messe München GmbH
category PRODUCT INNOVATIONS
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Messe München GmbH
Messe München GmbH
Olympus - semiconductor wafer inspection
Wafer inspection systems with automated wafer loaders go
DEK Solar - thin-film substrates
Photovoltaic metallization platform for the thin-film generation go
Siemens Industry Automation Division
New laser scanners safeguard small protection zones and transfer carriages go
Novatec -production process traceability
Sophisticated PCBA traceability to SMEs go
Essemtec - controlling software
New software for pick & place machines go
Interconnect Devices - interconnect solutions
Contact for QFN testing go
Siemens Division Industry Automation
Compact UHF readers for production and production-related logistics go
Skyray XRF - measurement system
X-ray fluorescence instrument for measuring plating thickness go
JTAG Technologies - scan module
Digital I/O scan module ideal for implementing boundary-scan and functional tests go
Baumer Electric - compact drives
Fast and Reliable Positioning go
Vitronics Soltec - good soldering results
Closed-loop preheater control ensures linear ramp profile, precise selective soldering control go
Essemtec - inline pick&place
New Pick & Place for 3D-MID go
MSD - Superdry
New generation MSD control cabinets go
Laser 2000 - Inkjet Printing System
Higher flexibility with inkjet printing systems for ophthalmic lens manufacturers go
Weiss Umwelttechnik - temperature and climate test chambers
The climate under control go
Manncorp - solder dipping system
Lead-free solder dipping system replaces manual methods go
Aster Technologies - coverage analysis tools
New generation of "easy to use" test coverage analysis tool go
JTAG Technologies
Digital I/O scan module ideal for implementing boundary-scan and functional tests go
Essemtec - SMD-silicone keys
Automatic SMD insertion of silicone keys go
Momentive - prepolymers
Prepolymers offer high tensile strength for next-generation structural adhesives go
IMS CHIPS and Robert Bosch
Contract to jointly develop and commercialize a fabrication process for ultra-thin chips go
Provertha - multi-sensor measurement system
3D video multi-sensor measurement technology for the manufacturing of precision plastic parts go
OKW Gehäusesysteme - cases
Small cases - attractive to carry go
Hover-Davis - auto­matic labeler
LPFN preprinted label feeder for Fuji go
SMAC - Moving Coil Actuator
Precision long life actuators for PCB assembly go
bedra - coated EDM wires
New coated EDM wires for higher cutting speeds go
Aerotech - galvo scanning head
Synchronised scanner extends the field of view for scanning head laser systems go
PA&E - Aluminum Silicon Carbide heat sink
AlSiC heat sinks offer reduced weight and improved thermal conductivity go
Indium Corporation - solder paste technology
First Rosin-Free, No-Clean, Cored Wire Solder go
Ziptronic direkt bond interconnect technology
Low temperature process employs nickel for reliable bonding without compression go
OK International - Soldering and Rework System
New soldering and rework systems increase production throughput and assure precision control go
Weidmüller - electronics housing system
Modular electronics housing system provides a home for individual electronics solutions go
Dual lane platform
DEK boosts throughput and flexibility with new Dual Lane RTC platform go
Vitronics Soltec - Precise Soldering Control
Selective Soldering System now features a wave height measurement system go
Alltec - fiber laser markers
New fiber laser marker family features the most compact design for unrivalled versatility go
Rittal at electronica 2008 - new subrack
Fast assembly, mechanical stability and simple handling go
Kulicke & Soffa - hub dicing blades
New series of hub dicing blades go
Binder - climatic chambers
New series of climatic chambers for constant conditions go
Manncorp - solder machine
Lead-free wave solder machine offers big performance in small space go
RPS - selective soldering systems
New selective soldering system delivers industries largest capacity native selective soldering range  go
Veeco - Web Coating Systems
New high throughput web coating platform for production of flexible thin film solar cells go
APS Novastar - Vision Control
Automated vision control for pick and place systems go
Pixargus - complete inspection of tubing surface
First-ever optical inline inspection of transparent tubing go
Rittal - 60-mm busbar system
First busbar system with "cULus-listed" approval go
Newport - thin film photovoltaic laser scribing systems
High throughput thin film photovoltaic laser scribing system go
Yxlon - at electronica 2008
Tape and reel inspection solution go
DEPRAG Schulz - Micro-Assembly-System
Assembly in the smallest of work areas go
Newport - laser scribing system
Thin film photovoltaic laser Scribing system go
J. Schmalz - Needle grippers
Needle grippers work where vacuum fails go
Novatec - production control tools
New suite of production control tools offering track and trace capabilities go
IPTE - Pin Insertion Machine
New innovative standards in press-fit technology go
KLA-Tencor - wafer inspection system
New monitor-wafer inspection system for the integrated circuit market go
Viscom - system for automatic wire bond inspection
Inspecting extremely small wire diameters at high speeds is now possible with wire bond AOI system go
Fexible SMD assembly system
Essemtec shows pick&place system FLX2011 at Electronica 2008 go
OK International - soldering system
Soldering system with enhanced thermal control go
Essemtec - stencil printer
Semi-automated paste printer features for vision system go
Aqueous Technologies
New automatic defluxing and cleanliness testing system go
RHE Microsystems - thermal management
Thick copper layer using thin film technology go
DEK - 2D Inspection
Software tool with 2D Inspection control go
IPTE - test cell
New test cell enables exact verification of objects to be tested with high pneumatic and hydraulic pressures in real-time go
Finetech - Contactless solder removal solutions
Solder removal head for contactless residual solder removal at large components go
DuPont Microcircuit Materials
Forward-looking technology in automotive electronic ceramic circuits using thick film compositions  go
Messe München GmbH
Messe München GmbH
category ANALYSIS-MARKET-TRENDS
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Messe München GmbH
Messe München GmbH
VDMA - electronics production
Electronics production equipment manufacturers expect turnover plus of five percent for 2008 go
SEMI Silicon Manufacturers Group (SMG)
Silcon wafer shipments contract in third quarter 2008 go
SEMI - book-to-bill
North American semiconductor equipment industry posts september 2008 Book-to-Bill Ratio of 0.76 go
Messe München GmbH
Messe München GmbH
category NEWS
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Messe München GmbH
Messe München GmbH
Metal-free MID technology
New compound: Laser produces electrically conductive structures go
3D-SIC technology
IMEC demonstrates 3D stacked integrated circuits go
Fraunhofer ISE
39.7% – New European Record Efficiency for Solar Cells go
Messe München GmbH
Messe München GmbH
category APPLICATIONS
Messe München GmbH
Messe München GmbH
Pixargus - optical inline inspection system
Complete surface inspection of cables go