Kulicke & Soffa Industries announced the launch of UniPlus -
a new series of hub dicing blades that provides improved cut quality,
longer blade life and increased productivity for a variety of chip
scale package (CSP) applications.
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Each blade in the UniPlus series is designed for a specific package
singulation application, including Ceramic, ball grid array (BGA)
substrates and quad flat no-lead (QFN) leadframes. This flexibility
allows customers to tailor their approach based on their individual
process and project requirements and improves overall cut quality.
UniPlus blades also utilize a harder nickel bond, which maximizes blade
life and permits higher feeding speeds than traditional bond materials.
UniPlus blades have a combination of superior dicing performance,
durability and productivity and provide users with significant cost of
ownership savings.
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