PRODUCT INNOVATIONS
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Manncorp - solder machine
Lead-free wave solder machine offers big performance in small space
An extraordinarily small footprint lead-free wave solder machine with
features claimed to exist in larger systems, has been introduced by
Manncorp. With dimensions of only 50" x 30" (1250 x 760mm), the C250,
according to CEO Henry Mann, was originally designed for the Japanese
electronics market, where factory floor space is a scarcity, while
demands for high precision and reliability remain essential.
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Handling boards up to 10" (250mm) wide in its adjustable
corrosion-resistant finger conveyor, the C250 is equipped with
automatic defluxing, IR preheating, air-knife cooling and an economical
low-volume solder pot for reduced startup time and operating costs. The
machine is available in either single or dual wave configurations for
through-hole and surface mount assemblies. It also includes built-in
solder pot loading, a maintenance platform with locking support
mechanism and dial-adjustable wave height control.
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