KLA-Tencor Corporation introduced the Surfscan SP2XP, a new
monitor-wafer inspection system for the integrated circuit (IC) market
that builds upon the success of its sister tool with the same name,
introduced last year for the wafer manufacturing market. The new
Surfscan SP2XP features improved sensitivity to defects on silicon,
poly and metal films and enhanced ability to sort defects by type and
size, compared with its predecessor, the industry-leading Surfscan SP2.
It also features vacuum handling and best-in-class throughput. These
capabilities are designed to enable chipmakers to bring their
leading-edge (?4Xnm) devices to market faster by delivering superior
process tool monitoring throughout the fab. The new system also
introduces an ultra-high sensitivity operating mode to accelerate
fabs’ development of 3Xnm and 2Xnm next-generation devices.
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“Manufacturers of high performance devices are seeing the
complexity of the chip-making process increase at the same time that
market windows for these devices are tightening,” observed Mike
Kirk, vice president and general manager of the Wafer Inspection Group
at KLA-Tencor. “The Surfscan SP2XP system addresses the need to
quickly flag process tools which are generating excessive defectivity,
so that the problem can be corrected with minimal wafer scrap, yield
loss and market delay. Our new tool addresses this challenge, not only
through advancements in sensitivity and throughput, but also by
introducing the capability to distinguish particles from microscratches
and residues without the need to expend resources on SEM review. We
believe the Surfscan SP2XP will help fabs accelerate production of
their leading-edge devices.”
Opto-mechanical and signal processing improvements are designed to
ensure capture of even the smallest defects on bare wafers, as well as
front-end and back-end films. Unique, patented multi-channel
architecture and innovative algorithms enable the Surfscan SP2XP system
to automatically differentiate defect types. The tool also delivers
superior throughput to that of the previous-generation,
industry-leading Surfscan SP2, enabling fabs to inspect more wafers per
hour or to use a higher sensitivity setting without loss of throughput.
The Surfscan SP2XP upholds the platform’s reputation for
reliability, ease-of-use and system matching
Strong interest in the Surfscan SP2XP system has resulted in several
orders from fab equipment manufacturers as well as leading logic and
memory fabs in Asia, the United States and Europe. The January 2007
release of the edge-handling version of the Surfscan SP2XP system, for
the wafer manufacturing market, has rapidly gained broad market
acceptance, with installations of multiple systems at every leading
wafer manufacturer.
TECHNOLOGY SUMMARY
Improvements to mechanical, optical and signal-processing subsystems
enable the Surfscan SP2XP monitor-wafer inspection system to deliver
several advantages over its predecessor, the industry-leading Surfscan
SP2. These include:
- Up to 36 percent throughput boost resulting from a combination of changes in opto-mechanics, electronics and software
- Unique,
patented multi-channel architecture that enables the Surfscan SP2XP
system to automatically distinguish particles from microscratches,
voids, watermarks and other residue
- The introduction of
Ultra-High Sensitivity mode, allowing the Surfscan SP2XP system to be
utilized for development of next-generation chips
- An
opto-mechnical innovation that enhances the tool’s sensitivity to
defects on rough films such as polysilicon, tungsten and copper.
Together with the platform’s benchmark sensitivity on smooth
films, the new capability allows the Surfscan SP2XP platform to be used
throughout the fab, thereby yielding potential improvements to the
fab’s operating efficienc
- A new differential interference
contrast (DIC) channel that enables capture of shallow, flat and faint
defects-of-interest such as residues or bumps—all of which can
result in device failure, particularly for advanced devices
- Newly
extended defect sizing capability, delivering improved defect binning
accuracy for faster identification of the defect source
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