PRODUCT INNOVATIONS
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Viscom - system for automatic wire bond inspection
Inspecting extremely small wire diameters at high speeds is now possible with wire bond AOI system
Viscom’s S6053BO-V brings the newest generation of fully
automatic wire bond inspection systems to market. The inspection system
was conceived specifically for small wire bond analysis. Both the
camera technology as well as the transport can be adapted to the most
widely varying production demands.
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The S6053BO-V is equipped with a universal, high-resolution VHR camera
module. These high quality optics make it possible to inspect down to
a resolution of 2 to 5 µm per pixel. The camera module can
be arrayed with one or several cameras and specialized illumination
units. Thus, even bond wires smaller than 20 µm in diameter can
be inspected 100%.
If faster cycle times are required, the S6053BO-V machine is available
in a dual track configuration. The dual track system includes an
integrated shuttle which loads the second track as an inspection is
conducted on the first track. This innovative transport concept
fulfills demands for the fastest cycle times.
The S6053BO-V design is configured for extremely fine bond wire
analyses, yet it can be utilized wherever small structures must be
resolved with precise accuracy. This opens up the inspection scope
beyond the inspection of wires. Components and ASICs are also inspected
with the same high accuracy. Of course the inspection scope includes
all classical inspection tasks associated with die and wire bonds. One
of the greatest benefits is Viscom’s image processing capability
to reliably identify defects even on very small mechanical components
and to measure them when required. This new technology, which allows
high-precision accuracy at high speeds, gives Viscom a clear
competitive advantage.
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