PRODUCT INNOVATIONS
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RHE Microsystems - thermal management
Thick copper layer using thin film technology
Special circuit boards are necessary for the use of state-of-the-art
semiconductor devices like laser diodes, LED’s and power
transistor and their high power losses. In this connection the current
carrying capacity of the conductive tracks and the thermal conductivity
of the base material are in demand. Consequently, the thermal
management, particularly the fast dissipation of heat generated by the
power loss, has an important influence on the loading capacity and life
time of the components.
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The design should be aimed at dissipating a maximum of heat relative to
the amount of space.DCB (Direct Copper Bonded) substrates with a 300
micron thick copper layer are used in the majority of cases. Such
boards come into use for power modules using IGBT’s or other
active parts up to 100 A.
Circuit boards with better track resolutions and similar current
carrying capacity compared to the DCB are necessary for new components
and sophisticated packaging solutions. It is possible to reach smallest
pattern resolution using the common thin film technology. But the
maximum current is limited by the thin conductive layers. Now RHe is
able to realize thin film circuit boards with conductive track
thickness of 50 – 100 micron.
These structures allow small tracks with a high power density. The
modified thin film technology offers significant advantages in terms of
design flexibility and frequency of conductive tracks. The thermal
resistance of the assembly could be reduced by a factor of two if AlN
(aluminium nitride) is used instead of alumina substrates. Hence, the
use of thin film ceramic substrates is feasible for power applications,
as follows:
- Laser diode submounts
- Submounts for LED`s
- Submounts for power transistors/diodes
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