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PRODUCT INNOVATIONS - JTAG Technologies - scan module
Digital I/O scan module ideal for implementing boundary-scan and functional tests

JTAG Technologies has introduced the new compact JT 2149/MPV Digital I/O Scan (DIOS) module, which allows digital I/O test access to PCBs requiring external I/O stimulus and response monitoring.

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PRODUCT INNOVATIONS

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Baumer Electric - compact drives
Fast and Reliable Positioning

Vitronics Soltec - good soldering results
Closed-loop preheater control ensures linear ramp profile, precise selective soldering control

Essemtec - inline pick&place
New Pick & Place for 3D-MID

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ANALYSIS-MARKET-TRENDS

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SEMI - book-to-bill
North American semiconductor equipment industry posts september 2008 Book-to-Bill Ratio of 0.76

According to iSuppli:
Electronics contract manufacturing business to stay afloat during recession

Gartner says
Worldwide semiconductor capital equipment spending to decline 26 Percent in 2008

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NEWS

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Metal-free MID technology
New compound: Laser produces electrically conductive structures

3D-SIC technology
IMEC demonstrates 3D stacked integrated circuits

Fraunhofer ISE
39.7% – New European Record Efficiency for Solar Cells



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Pixargus - optical inline inspection system
Complete surface inspection of cables

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News - 23.11.2008

Higher flexibility with inkjet printing systems for ophthalmic lens manufacturers
The new Inkjet Printing system from Laser 2000 provides great flexibility and gives the lens manufacturer great market advantage. The MC-Jet replaces limited pad changers. Different images on the lenses are now simply placed by software.

North American semiconductor equipment industry posts september 2008 Book-to-Bill Ratio of 0.76
North America-based manufacturers of semiconductor equipment posted $754 million in orders in September 2008 (three-month average basis) and a book-to-bill ratio of 0.76 according to the September 2008 Book-to-Bill Report published today by SEMI.

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