PRODUCT INNOVATIONS
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New batch-type lead-free reflow oven for low-volume users
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Productronica 2007 Exhibitors for this topic: |
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An economical batch-type lead-free reflow oven designed to meet the
needs of short-run assemblers with limited budgets or floor space has
been introduced by Manncorp. The T200A is capable of attaining
lead-free temperatures to 300ºC and offers a performance envelope
of only ±1 °C across a generous 360mm x 230mm (14" x 9")
processing area.
Using a mix of quartz infrared and hot air convection, said to be ideal
for lead-free processing, the oven will solder microchips and other SM
devices in accordance with manufacturer-recommended profiles. It will
precisely generate and store 20 to 40 sequential time and temperature
settings. The oven can also be used for curing and drying applications.
Manncorp officials anticipate that the T200A will find great acceptance
among prototypers, labs, schools and others with fast turnaround
soldering requirements.
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