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Rittal at electronica 2008 - new subrack
Fast assembly, mechanical stability and simple handling
At Electronica 2008, Rittal will be unveiling Ripac EASY, a new subrack system for standard applications, whose pre-mounted screws permit dramatic shortening of the time required for assembly. The system promises simple handling, and can also be chosen where tougher operating conditions are to be expected.
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PRODUCT INNOVATIONS
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Kulicke & Soffa - hub dicing blades
New series of hub dicing blades
Binder - climatic chambers
New series of climatic chambers for constant conditions
Manncorp - solder machine
Lead-free wave solder machine offers big performance in small space
ANALYSIS-MARKET-TRENDS
more articles (5)
Gartner says
Worldwide semiconductor capital equipment spending to decline 26 Percent in 2008
Lux Research - solar market
Despite price erosion, solar market reaches $100 Billion in 2013
Now available through Aarkstore.com
China solar grade wafer or Ingot Industry Research Report
NEWS
more articles (2)
3D-SIC technology
IMEC demonstrates 3D stacked integrated circuits
Fraunhofer ISE
39.7% – New European Record Efficiency for Solar Cells
More flexibility and customer orientation
Carve-out of Siemens Electronics Assembly Systems proceeding on schedule
APPLICATIONS
Pixargus - optical inline inspection system
Complete surface inspection of cables
Heller Industries - Reflow ovens
Reflow ovens solution to the challenges of increased productivity and greater flexibility
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News - 16.10.2008
IMEC demonstrates 3D stacked integrated circuits
IMEC announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5µm Cu through-silicon vias (TSV). It will now further develop 3D SIC chips on 200mm and 300mm wafers, integrating test circuits from partners participating in its 3D integration research program.
Worldwide semiconductor capital equipment spending to decline 26 Percent in 2008
A collapse in memory spending, combined with a weak economy, is driving a major contraction in semiconductor capital equipment spending in 2008, according to Gartner, Inc. The slowdown is expected to continue into 2009 before the industry recovers in 2010.
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