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PRODUCT INNOVATIONS
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Pixargus - complete inspection of tubing surface
First-ever optical inline inspection of transparent tubing
For the manufacture of medical technology products, Pixargus presents its new ProfilControl 5-Medictube inline inspection system. It is the first system to enable optical inline inspection of transparent tubing. As defects, such as inclusions or inhomogeneities, are detected already during the production process, overall manufacturing becomes much more efficient.
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PRODUCT INNOVATIONS
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Rittal - 60-mm busbar system
First busbar system with "cULus-listed" approval
Newport - thin film photovoltaic laser scribing systems
High throughput thin film photovoltaic laser scribing system
Yxlon - at electronica 2008
Tape and reel inspection solution
DEPRAG Schulz - Micro-Assembly-System
Assembly in the smallest of work areas
Newport - laser scribing system
Thin film photovoltaic laser Scribing system
J. Schmalz - Needle grippers
Needle grippers work where vacuum fails
Novatec - production control tools
New suite of production control tools offering track and trace capabilities
IPTE - Pin Insertion Machine
New innovative standards in press-fit technology
KLA-Tencor - wafer inspection system
New monitor-wafer inspection system for the integrated circuit market
Viscom - system for automatic wire bond inspection
Inspecting extremely small wire diameters at high speeds is now possible with wire bond AOI system
Fexible SMD assembly system
Essemtec shows pick&place system FLX2011 at Electronica 2008
OK International - soldering system
Soldering system with enhanced thermal control
Essemtec - stencil printer
Semi-automated paste printer features for vision system
Aqueous Technologies
New automatic defluxing and cleanliness testing system
RHE Microsystems - thermal management
Thick copper layer using thin film technology
DEK - 2D Inspection
Software tool with 2D Inspection control
IPTE - test cell
New test cell enables exact verification of objects to be tested with high pneumatic and hydraulic pressures in real-time
Finetech - Contactless solder removal solutions
Solder removal head for contactless residual solder removal at large components
DuPont Microcircuit Materials
Forward-looking technology in automotive electronic ceramic circuits using thick film compositions
Fritsch - standalone operation, batch system, inline system
For our automatic Pick&Placer - different feeding concepts for circuit boards
Vi Technology - AOI Solutions
AOI with large boards capability and multi-lanes option
Reinhardt Microtech - technology news
Solid copper filled via in thin film technology
Finetech - all-in-one solution
Rework of QFN – no compromises
ERSA - increased throughput and flexibility
New selective platform for high volume in-line soldering
AMO - graphene crystallites
Graphen-Substrate made in Germany
AlternativeSMT at Electronic India 2008, September 2nd to 5th at Bangalore
FeederMaster - a multi-platform feeder test jig
AMO - graphene crystallites
Graphen-Substrate made in Germany
Fraunhofer-Institut für Werkstoffmechanik IWM
Computer simulates thermal stress
Schroff - Customising cabinets
Individually modified standard cabinets
Essemtec - automated stencil printer
New automated printer with sideways moving loading drawer
3D Systems - 3-D Printer
New affordable, high-definition 3-D printer
Viscom - AOI/AXI
In-line X-ray inspection with parallel AOI/AXI
Speedprint - stencil printer
New smallest inline stencil printer
JTAG Technologies - boundary-scan
Easy-to-use software tool with extraordinary test comprehensiveness
Essemtec - twin vacuum table
New placement machine for flex board and film substrate features twin vacuum table
ACE - selective soldering equipment
"True position” high accuracy selective soldering
DuPont - polymers based on renewable resources
Tailored thermoplastics exceeding traditional materials
Hesse & Knipps - Wire bonder
Wire bonder for solar market
Mirtec - desktop AOI machine
AOI Systems for manufacturing defects both pre and post reflow
Laser Lines
Laser marking printed label
Transition Automation - Paste Manager
Electronic paste manager self-cleaning squeegee system
Essemtec - screen/stencil printer
New semi-automatic printer with vision and stencil cleaning
Manncorp - pick and place system
Low-to-mid-volume placers for long-term reliability
GeBE Elektronik und Feinwerktechnik
Compact kiosk printer for space sensitive installations
DuPont Microcircuit Materials - Frontside Metallization
Thick-film metallization paste delivers up to 0.5% more efficiency for PV cells
ACS - motion controller
Motion controllers provide sub-nanometer resolution
Schroff - MicroTCA
Compact new MicroTCA system allows horizontal board mounting
Rittal - low-voltage switchgear systems
Better protection against accidental arcing
XACTIX and Surface Technology Systems
CVE Etch Module for xenon difluoride gas
Rittal - battery manager
Longer life for UPS batteries
Rittal - Bayable server cooling
Flexible, high-performance climate control with monitoring and without raised floor
Knürr - dynamic cooling system
Energy efficiency with optimum server virtualization management
S+P Samson - industrial identification
New high temperature labelling and RFID-based warehouse management systems
Edac - IDC contacts
IDC contact for surface mount saves costs
Soldering and Rework System
OK International looks forward to ElectronicIndia 2008
Data I/O - inline automated programming solution
Just-in-Time programming solutions for automotive applications
Asmetec - MiniScope
Handheld digital microscope
Wacker Chemie - UV-active silicone elastomers
UV-active silicones for the microelectronics industry
Moritex - industrial endoscopes
Portable video endoscope offers full multimedia capabilities
austriamicrosystems - analog/mixed-signal designs
High-Voltage IO library offering 4KV ESD protection
Essemtec - product quality
Measurement option verifies components directly in the placement machine
Moritex - borescopes
Inspecting mission-critical manufactured parts, components and products
Siemens - Coplanarity Module
Closer to zero-defect production - with fast 3D sensors
IMEC - thin crystalline silicon wafers
New promising method to fabricate ultra-thin silicon solar cells
ANALYSIS-MARKET-TRENDS
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SEMI reports:
Worldwide semiconductor manufacturing equipment: $7.83 billion in the second quarter of 2008
Seventy Fab projects brighten industry outlook in 2009
World Fab forecast projects over 20% in increase in fab spending in 2009
Electronics.ca Publications - Industry Report
40% of the world's PCB is produced in the uppermost manufacturing bases - China and Taiwan
NEWS
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Fraunhofer ISE
39.7% – New European Record Efficiency for Solar Cells
More flexibility and customer orientation
Carve-out of Siemens Electronics Assembly Systems proceeding on schedule
STMicroelectronics, STATS ChipPAC and Infineon
Milestone in establishing wafer-level-packaging industry standard
APPLICATIONS
Pixargus - optical inline inspection system
Complete surface inspection of cables
Heller Industries - Reflow ovens
Reflow ovens solution to the challenges of increased productivity and greater flexibility
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October 13-16, 2008
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November 11-14, 2008
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News - 07.10.2008
High throughput thin film photovoltaic laser scribing system
Newport Corporation announced the latest addition to the SolaryX family of industry-leading thin film photovoltaic laser scribing systems - the SolaryX 1600P laser scribing system. The SolaryX 1600P tool is a fully automated solution that was designed for full production photovoltaic manufacturing environments. It offers a fast, flexible, and accurate means to scribe thin film solar panels.
Carve-out of Siemens Electronics Assembly Systems proceeding on schedule
Effective October 1, 2008, most international units of the Siemens business unit Electronics Assembly Systems will have been converted to legally independent companies. With this step the Siemens AG starts to execute its plan to legally separate the former EA unit from Siemens’ Drive Technologies Division. The newly established company with the name Siemens Electronics Assembly Systems (Siemens EA) will be a wholly-owned subsidiary of Siemens Drive Technologies with headquarters in Munich.
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