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PRODUCT INNOVATIONS - Reinhardt Microtech - technology news
Solid copper filled via in thin film technology

Reinhardt Microtech keeps in touch with today’s increasing demands on substrate performance. As the circuits in the field of RF applications are improving in performance, also the substrates which carry the circuits have to. One outstanding example is the use of solid filled via to realize the electrical connections between front and back side of substrates. While many competitors in this field are still struggling with problems, Reinhardt Microtech developed a reliable, high-yield production method therefore.

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PRODUCT INNOVATIONS

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Finetech - all-in-one solution
Rework of QFN – no compromises

ERSA - increased throughput and flexibility
New selective platform for high volume in-line soldering

AMO - graphene crystallites
Graphen-Substrate made in Germany

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ANALYSIS-MARKET-TRENDS

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Seventy Fab projects brighten industry outlook in 2009
World Fab forecast projects over 20% in increase in fab spending in 2009

Electronics.ca Publications - Industry Report
40% of the world's PCB is produced in the uppermost manufacturing bases - China and Taiwan

EMS - ODM - CM Industry
Global contract manufacturing transforms by 2013

Silicon solar production initiatives
Thin-film technology - new solar PV trend in Taiwan

Gartner - Worldwide wafer fab equipment
Worldwide semiconductor capital equipment spending to decline 22 percent in 2008

DuPont Electronic Technologies
Raw material, transportation and energy costs - global price increase

SEMI - Semiconductor manufacturing equipment
First quarter of 2008 worldwide semiconductor manufacturing equipment

European Commission
EU to double its R&D investment in robotics



	NEWS

STMicroelectronics, STATS ChipPAC and Infineon
Milestone in establishing wafer-level-packaging industry standard

Essemtec
New Website with integrated application reports

At VLSI Symposium
IMEC reports progress on simplified high-k/metal gate process for the 32nm node



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Heller Industries - Reflow ovens
Reflow ovens solution to the challenges of increased productivity and greater flexibility

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News - 05.09.2008

Rework of QFN – no compromises
With the “Direct Component Printing (DCP) Module”, Finetech offers an all-in-one solution for all FINEPLACER rework stations. After the QFN component has been placed on the printing stencil using the FINEPLACER beam splitter optics, new solder paste can be applied consistently with a mini squeegee.

World Fab forecast projects over 20% in increase in fab spending in 2009
According to the World Fab Forecast report, recently released by SEMI, a projected decline in world semiconductor fab equipment spending of 20 percent is expected for 2008, but a rebound of over 20 percent in spending is expected in 2009, driven by over seventy fab projects. The August 2008 edition of the report lists 53 fab equipping projects and up to 21 construction projects for fabs in 2009.