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Company data: Henkel KGaA |
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| 1.2.3.2.8 Potting compounds, encapsulations |
| 1.2.3.3.3.1 Impregnating machines for metal |
| 1.2.3.3.3.2 Vacuum pressure impregnating machines |
| 1.2.3.3.3.4 Impregnating machines for laboratory and special applications |
| 8.1.1 Solders, leaded |
| 8.1.2 Solders, unleaded |
| 8.1.3 Soldering pastes, leaded |
| 8.1.4 Soldering pastes, unleaded |
| 8.1.5 Flux for soldering |
| 8.6.9 Soldering accessories, miscellaneous |
| 8.7.1.1 SMD adhesives |
| 8.7.1.2 Acrylic/epoxy adhesives |
| 8.7.1.3 Hot-melt adhesives |
| 8.7.1.4 Adhesives, anisotropic |
| 8.7.1.5 Adhesives, electrically conductive |
| 8.7.1.6 Adhesives, heat-conducting |
| 8.7.1.11 Adhesives, miscellaneous |
| 8.7.2.1 Adhesive dispensers |
| 8.7.2.10 Adhesive-processing equipment, miscellaneous |
| 9.3.3.1 Protective lacquers |
| 9.3.3.2 Encapsulating materials |
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Current events
| Exhibitor - Information material |
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| The official trade fair catalogue for productronica 2007 |
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