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Company data: Atotech Deutschland GmbH |
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| You find us on Productronica 2007 |
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| Hall B3, Booth 105 |
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| System Solutions for PCB and Semiconductor Fabrication |
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| 1.1.4.1.7 Process chemicals, semiconductor technology, miscellaneous |
| 2.4.2.1.1 Copper anodes |
| 2.4.2.1.2 Tin anodes |
| 2.4.2.1.3 Tin-lead anodes |
| 2.4.2.1.4 Silver anodes |
| 2.4.2.1.5 Anodes, miscellaneous |
| 2.4.2.2.4 Anode hangers, anode baskets |
| 2.4.2.3.1 Gilding baths |
| 2.4.2.3.2 Nickel baths |
| 2.4.2.3.3 Process chemicals, electroplating |
| 2.4.2.3.4 Electroplating chemicals, miscellaneous |
| 2.4.2.4.1 Electroplating facilities, vertical |
| 2.4.2.4.2 Continuous horizontal electroplating lines |
| 2.4.2.4.7 Drums, electroplating |
| 2.4.2.4.14 Electroplating equipment, miscellaneous |
| 6.1.2.2 Cu foils for base materials |
| 6.1.3.3 Epoxy/glass laminates/prepregs, copper-coated |
| 6.1.3.6 PTFE/glass laminates |
| 6.1.3.11 Base materials, special-purpose |
| 6.2.1.1.1 Photochemicals |
| 6.4.2.1.1 Liquid photo resists |
| 6.5.1.2 Etching resists |
| 6.5.3 Through-plating |
| 6.5.4.1 Via-hole plugging machines |
| 6.5.4.2 Via-hole plugging inks |
| 6.5.5.2 Chemical tin deposition |
| 6.5.5.3 Chemical gold/silver deposition |
| 6.5.5.4 Chemical palladium |
| 6.5.5.6 Copper passivation |
| 6.5.7.2 PCB hole cleaning (de-smearing) |
| 6.7.2 Solder-resist lacquers |
| 12.5.3.3 Tin strippers |
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Current events
| Exhibitor - Information material |
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| The official trade fair catalogue for productronica 2007 |
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