anchor Conference schedule
anchor International Conference on Advanced Automotive Electronics Technology
anchor 6th Mobile Communication IC Design & Application Senior Technology Seminar
anchor 4th International Connector Technology Forum (ICTF 2008)

Messe München GmbH
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electronica & ProductronicaChina 2008
Conference schedule


DateTimeConference RoomTopicOrganizer
Mar 1709:45 - 16:15E2-M19International Conference on Advanced Automotive Electronics Technology
Messe München International
Society of Automotive Engineers of China
09.00 - 16.30E3-M23IPC Electronics Manufacturing ConferenceIPC
IPC Shanghai
Messe München International
09:00 - 16:30E3-M246th Mobile Communication IC Design & Application Senior Technology SeminarMesse München International
Electronic Design & Application World
Mar 1809:30 - 16:15E2-M19International Conference on Advanced Automotive Electronics Technology
Messe München International
Society of Automotive Engineers of China
09:00 - 16:30E3-M23IPC Electronics Manufacturing ConferencePC
IPC Shanghai
Messe München International
09:00 - 17:00E3-M244th International Connector Technology Forum (ICTF 2009)Messe München International
Electronic Engineering & Product World
Mar 1909:00 - 16:30E3-M23
IPC Electronics Manufacturing ConferencePC
IPC Shanghai
Messe München International

Messe München GmbH
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International Conference on Advanced Automotive Electronics Technology


The number of electronic functions in automobiles is increasing rapidly. This poses new challenges and changes the way OEMs and various suppliers along the value chain need to interact. It also considerably affects market conditions: customers, for instance, expect more and more comfort, security and engine efficiency, regardless of the car category in which they would like to invest.

The Symposium will present the latest, the most advanced and the most effective products and technologies. Special segments such as passive components, power semiconductor, cables processing and SMT will show the application of automotive electronics in auto safety, control , communication, navigation and infotainment.

The symposium is organized by Messe München International and the Society of Automotive Engineers of China.

Symposium topics:
  • General applications of automotive electronics
  • Applications in power assembly systems
  • Applications in the field of auto safety
  • Applications in communication, navigation and infotainment

Organizer: Munich International Trade Fairs, Society of Automotive Engineers of China

Messe München GmbH
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6th Mobile Communication IC Design & Application Senior Technology Seminar


The international standing of the Chinese IC market makes unceasing progress. The Chinese application of 3G is nearly put into operation and the TD-SCDMA communication standard was gradually finished. The cutting edge technology of TD-SCDMA has already been fulfilled. This is a milestone in the field of Chinese mobile communication for 2008.

The seminar promotes the development of the Chinese communication industry, enhancing the Chinese ability of competition in the international level and providing a platform of industry experts to perform technical exchange. On the occasion of the seminar, many famous companies in this field have been invited to introduce latest technology and advanced solutions in global communication electronic technology to national engineers. 

Seminar topics:

  • Application of Communication IC 
  • 3G communication equipment and terminal technology 
  • Comprehensive layout of IC design
  • Simulation of RF and mixed signal for IC design
  • Application of 3G (WCDMA, CDMA200, TD-SCDMA) communication and IC
  • WiMAX, WLAN and UWB technology
  • Network processor and co-processor technology
  • Optical communication
  • Wireless Communication security etc.
  • Communication Test & Measurement Technology
  • T&M technology and solutions on wireless communication
  • Application of equipment for T&M 
Organizer: Electronic Design & Application World


Messe München GmbH
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4th International Connector Technology Forum (ICTF 2008)


This year has seen the dramatic change in the global connector market pattern. Facing the slowing down of the demands for connectors in the European and American markets and the rising of the raw material prices, facing the opportunities brought along with the vibrant growth in Asian and Chinese markets, and facing the changes in the demands from upstream customers in connector application, the connector vendors must be able to show their acumen to market dynamics, and keep up with the steps of market demand, and achieve competitiveness through continuous innovations and mutual cooperation for the absorption of others’ experience.
 
The seminar helps relative companies to keep acquainted with the latest market trends and connector technology advancement at home and abroad, to enhance the technical content of products, to provide a technical and cooperation platform for domestic and international electronic connector manufacturers, and to promote the mutual exchanges and interoperability.

Seminar topics:
  • Marketing Analysis & Technique Develop Trend of Connector
  • ITT Harsh Environment Connector Applications on Transportation Market
  • The Usage of New Generation of Card-edge connectors & Outdoor connectors
  • DURACON - Fe-based material for miniaturization of contact spring elements
  • SUPRALLOY – High Performance Bronze for Miniaturized Connectors
  • Reliability Analysis of fast plug connector
  • Application and Development of Connector in Military Area
Organizer: Electronic Engineering & Product World


Messe München GmbH
Messe München GmbH