AUTOMOTIVE INNOVATION 
category PRODUCT INNOVATIONS - Renesas - SRAM
SRAM for automotive applications

Renesas Technology Europe announced that it has commenced development of low power and fast SRAM products that are specifically suited to automotive applications. They are available as 4, 16, or 32Mbit low power SRAM and 4Mbit fast SRAM devices. go


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Freescale - automotive microcontroller
World’s most powerful automotive microcontroller for ‘green’ engine design go
STMicroelectronics - electrochrome mirror controller
Integrated automotive IC consolidates door-mounted drivers for cost, assembly, and reliability advantages go
Freescale - microcontroller
8-bit microcontrollers enhance accuracy for automotive and industrial designs go
Messe München GmbH
Messe München GmbH
category ANALYSIS-MARKET-TRENDS
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Messe München GmbH
According to iSuppli:
Automotive MEMS sensor market to nearly double by 2012 go
ecs: Price reductions significantly slowing down
Trend for automotive electronics prices changes go
IMS Research - Report
Growth in the market for automotive sensors go
Messe München GmbH
Messe München GmbH
category NEWS
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Messe München GmbH
electronica automotive conference:
Secure early booking prices now for the expert forum on automobile electronics go
Joint research project started
BMZ, University of Applied Sciences Aschaffenburg and Linde develop energy storage system for electric vehicles go
Cars that talk
Commission earmarks single radio frequency for road safety and traffic management go
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Messe München GmbH
category EVENTS
Messe München GmbH
Messe München GmbH
Munich International Congress Center (ICM)
electronica automotive conference 2008 with Experts from Leading International Companies go
Booming market India
"Call for Presentations" for the Automotive Symposium running parallel to "electronicIndia 2008" go
EMBEDDED SYSTEMS 
category PRODUCT INNOVATIONS - Xilinx and Eutecus - analytics suite
New programmable embedded video analytics platform

Xilinx and Alliance Program member Eutecus present the industry's first full video analytics suite on a single field programmable gate array (FPGA). The analytics suite leverages the digital signal processing capabilities of the Xilinx Spartan-3A DSP FPGA platform and a Multi-core Video Analytics Engine (MVE)) from Eutecus. go


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Cypress - detection solution
Proximity sensing solution delivers industry-leading detection range of up to 25 centimeters go
Lattice Semiconductor - FPGAs
Low power cores bolstered with enhanced buffer management features go
Aster Technologies - coverage analysis tools
New generation of "easy to use" test coverage analysis tool go
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Messe München GmbH
category ANALYSIS-MARKET-TRENDS
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Messe München GmbH
In-Stat’s report
New SSD makers hitting the market go
Darnell Group - strategic information
Profits will be harvested go
Darnell Group - long-term changes in power system architectures
Tectonic shifts occurring in DC-DC converter markets go
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Messe München GmbH
category NEWS
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Messe München GmbH
Final Report - electronica 2008
Electronics industry pins great hopes on “green electronics” go
electronica 2008
Expectations more than fulfilled: electronica automotive conference 2008 go
130 companies from ten countries:
New trade fair hybridica getting off to a fantastic start go
MICRONANO-SYSTEMS 
Wellenlängendispersives Röntgenspektrometer kombiniert automatisch energiedispersive Röntgenspektroskopie mit WDS Operationen category PRODUCT INNOVATIONS - Thermo Fisher Scientific
New X-ray Spectrometer with first completely integrated EDS/WDS system

Thermo Fisher Scientific announced the launch of the first intelligent Wavelength Dispersive X-ray spectrometer (WDS), the Thermo Scientific MagnaRay™ WDS Spectrometer. The instrument automatically combines energy dispersive spectroscopy (EDS) results with WDS operations using the embedded expert system. go


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category PRODUCT INNOVATIONS
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Royston - lab on a chip
Intelligent pump system will advance microfluidic applications go
STMicroelectronics - MEMS gyroscope
Ultra-compact MEMS gyroscope provides analog and digital outputs for design flexibility and system partitioning go
STMicroelectronics and Debiotech
First prototypes of disposable insulin nanopump go
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Messe München GmbH
category ANALYSIS-MARKET-TRENDS
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Messe München GmbH
electronics.ca publications - report
Thin films in energy applications emerging its market, reaching $3.9 Billion in 5 years go
iSuppli - Microelectromechanical Systems
Sensors take the growth baton in the global MEMS market go
micronano-systems
Multiple MEMS potential will provoke market explosion go
Messe München GmbH
Messe München GmbH
category NEWS
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Messe München GmbH
Max Planck Institute of Biochemistry - Nano-Photonics
Terahertz goes Nano go
micronano-systems
Nano charges to rescue lithium go
micronano-systems
Nanowires with large scale ambitions go
Messe München GmbH
Messe München GmbH
category EVENTS
Messe München GmbH
Messe München GmbH
Thurs 19th March 2008, The Royal Society, London
3rd International Conference on Nanotechnology and Smart Textiles for Industry, Healthcare and Fashion go
WIRELESS COMMUNICATION 
category ANALYSIS-MARKET-TRENDS - Indian Wireless Market
WiMAX, 3G and number portability to drive Indian Wireless Market in 2009
 go


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CML Microcircuits - RF Quadrature Modulator
New I/Q modulator offering 100MHz to 1GHz operation go
Taiyo Yuden - chip antenna
Industry's thinnest 2,4GHz chip antenna go
Keithley - software platform
RF communications toolkit software to provide both signal generation and analysis go
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Messe München GmbH
category ANALYSIS-MARKET-TRENDS
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Messe München GmbH
According to ABI Research
Wi-Fi chipset revenue on course to approach $3 Billion in 2008 go
Forward Concepts - new annual study
Cellular Handset & Chip Markets '08 go
iSuppli - wireless semiconductor market
Wireless semiconductors outgrow overall chip market in 2007 go
Messe München GmbH
Messe München GmbH
category NEWS
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Wireless Congress at electronica 2008
Top iSuppli analysts to give keynote address at 2008 Wireless Congress go
Wireless
Focus on best fit for ZigBee go
Wireless
Hitting the wireless market running go
Wireless
Adding a new dimension to wireless device packaging go
STMicroelectronics and NXP
New company ST-NXP Wireless prepares to enter global market go
Wireless Congress 2008
Call for Papers runs until June 6 go
Wireless Congress 2008: Call for Papers runs until June 6
Focal themes: Embedded Wireless, M2M, Data/sensor Networks, Automation, Mobile communication go
WiMAX Forum
Certification Laboratory in India go