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INDUSTRY TOPICS

electronica-Eingang-West

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NEWS - Online ticket registration for visitors to the electronica 2008
Be sure to get your entrance ticket now to benefit from attractive prices

The electronica 2008 starts on 11 November 2008. The fair has already started online: Participants at the electronica 2008 can find out about trade fair highlights, exhibitors and the range of conference and background events for the world's leading fair for components, systems and their applications in the field of electronics and plan what they will be doing at the fair under www.electronica.de/en.

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PRODUCT INNOVATIONS

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AnalogicTech - flash drivers
High current WLED flash drivers offer smaller alternative to xenon lamps

Lattice Semiconductor and Arrow Electronics
Configurable video platform now available

MIPS - IP core
First 40nm and first USB-certified 1.8v 45nm IP cores

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ANALYSIS-MARKET-TRENDS

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iSuppli - Microelectromechanical Systems
Sensors take the growth baton in the global MEMS market

Vishay Siliconix - MOSFETs
p-channel power MOSFETs in the PowerPAK SC-75

iSuppli warns:
U.S. falling behind in eco-friendly car electronics

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NEWS

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electronica automotive conference:
Secure early booking prices now for the expert forum on automobile electronics

Joint research project started
BMZ, University of Applied Sciences Aschaffenburg and Linde develop energy storage system for electric vehicles

International CEO Round Table during electronica 2008
What contribution is the semiconductor industry making to climate protection?



	EVENTS

Munich International Congress Center (ICM)
electronica automotive conference 2008 with Experts from Leading International Companies

Booming market India
"Call for Presentations" for the Automotive Symposium running parallel to "electronicIndia 2008"

Thurs 19th March 2008, The Royal Society, London
3rd International Conference on Nanotechnology and Smart Textiles for Industry, Healthcare and Fashion

Industrial Topics

Individuell angepasste Standard-Schränke

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PRODUCT INNOVATIONS - Schroff - Customising cabinets
Individually modified standard cabinets

Today, customer services are just as important as a qualitatively high product value. Increasingly, customers are looking for complete solutions for the entire product lifecycle. Accordingly, Schroff has extended all its pre-sales and after-sales services and combined them into the "ServicePLUS" programme with eight distinct modules.

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PRODUCT INNOVATIONS

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Essemtec - automated stencil printer
New automated printer with sideways moving loading drawer

3D Systems - 3-D Printer
New affordable, high-definition 3-D printer

Viscom - AOI/AXI
In-line X-ray inspection with parallel AOI/AXI

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ANALYSIS-MARKET-TRENDS

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Electronics.ca Publications - Industry Report
40% of the world's PCB is produced in the uppermost manufacturing bases - China and Taiwan

EMS - ODM - CM Industry
Global contract manufacturing transforms by 2013

Silicon solar production initiatives
Thin-film technology - new solar PV trend in Taiwan



	NEWS

STMicroelectronics, STATS ChipPAC and Infineon
Milestone in establishing wafer-level-packaging industry standard

Essemtec
New Website with integrated application reports

At VLSI Symposium
IMEC reports progress on simplified high-k/metal gate process for the 32nm node



	APPLICATIONS

Heller Industries - Reflow ovens
Reflow ovens solution to the challenges of increased productivity and greater flexibility

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events

Current events

electronicIndia
September 02-05, 2008 link

electronicAsia
October 13-16, 2008 link

electronica
November 11-14, 2008 link

News - 28.08.2008

Configurable video platform now available
Lattice Semiconductor announced that Arrow Electronics has developed and released an advanced FPGA-based video and imaging solution, the EasyLCD System. This system meets the image processing speed and quality standards required by the automotive, marine, consumer, building automation and industrial control markets.

First 40nm and first USB-certified 1.8v 45nm IP cores
MIPS Technologies has introduced the industry´s first 40nm USB PHY IP core and first USB-certified 1.8v 45nm USB PHY IP core. These IP cores enable developers to quickly and confidently integrate USB functionality into their advanced SoCs for a vast number of consumer applications.