News, resources and business contacts
for the global electronics industry
HOME
ELECTRONIC COMPONENTS, SYSTEMS, APPLICATIONS
ELECTRONIC MANUFACTURING
INDUSTRIAL TOPICS
BUSINESS LIFE
EVENTS
COMPANY INDEX
CAREER CENTER
KEYWORD SEARCH
Keyword
Search
COMPANY INDEX
PARTNER
|
Deutsch
Company search - list
Company search
Companies
1 - 20 page
1
2
next
Company search by catalog key word, product index, branches index or alphabetical
Alphabetical search
Y
: (23 hits)
Company
Country
ZIP
YAMAICHI ELECTRONICS
Deutschland GmbH
Germany
81829
YAMAICHI ELECTRONICS
Deutschland GmbH
Germany
81829
Yangjie Electronic Import &
Export Co., Ltd.
China
225009
Y.C. Cable Europe s.r.o.
Czech Republik
160 00
YCL Electronics Co. Ltd.
Taiwan
830
Yeebo LCD Limited
Hongkong
Yeh Technology Co. Ltd.
Taiwan
000
Yellow Stone Corp.
Taiwan
112
Yestek Limited
United Kingdom and Northern Ireland
PA5 8JP
Yetda Industry Limited
Hongkong
Yih Hwa Bobbin Enterprises
Co., Ltd.
Taiwan
235
Yimtex Electronic Co., Ltd.
Taiwan
221
Yinpin Electronics (Shenzhen)
Co., Ltd.
China
518117
Y-Lynx Sarl
Switzerland
1400
Yokogawa Europe B.V.
Netherlands
3821 AL
Y.S. Tech
Yen Sun Technology Corp.
Taiwan
814
Yueqing Baihui Electronic
Plastic Co., Ltd.
China
325608
Yueqing Dongnan Electronics
Co., Ltd.
China
325600
Yueqing Xindali
Industries Co., LTD.
China
325604
Yung Tai Feng Electronic
Technology Co.Ltd.
Taiwan
711
1 - 20 page
1
2
next
Current events
electronicAsia
October 13-16, 2008
electronica
November 11-14, 2008
electronica & ProductronicaChina
March 17-19, 2009
electronicAmericas
electronicIndia
productronica
News - 16.10.2008
IMEC demonstrates 3D stacked integrated circuits
IMEC announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5µm Cu through-silicon vias (TSV). It will now further develop 3D SIC chips on 200mm and 300mm wafers, integrating test circuits from partners participating in its 3D integration research program.
Worldwide semiconductor capital equipment spending to decline 26 Percent in 2008
A collapse in memory spending, combined with a weak economy, is driving a major contraction in semiconductor capital equipment spending in 2008, according to Gartner, Inc. The slowdown is expected to continue into 2009 before the industry recovers in 2010.