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L
: (95 hits)
Company
Country
ZIP
Lab Circuits, S.A.
Spain
08460
LACKWERKE PETERS GmbH + Co KG
Speziallacke für d. Elektronik
Germany
47906
LACROIX ELECTRONIQUE
France
49115
Laird Technologies GmbH
Germany
83026
Lambda GmbH
Germany
77855
Landenhammer Elektronik e.K.
Germany
84437
Langendorf Textil GmbH & Co. KG
Germany
96364
Langer EMV-Technik GmbH
Germany
01728
Lantronix
France
78280
Lantronix Inc.
USA
La Pratique Electronique
Tunisia
8060
LASER COMPONENTS GmbH
Germany
82140
Laser Cutting - Ceramics Ltd.
United Kingdom and Northern Ireland
Laser Electronics
Germany
15732
LaserMicronics GmbH
Germany
30827
Laser Star GmbH
Germany
82140
Johann Lasslop GmbH - Induktive Bauteile
Germany
36088
Heinz-Günter Lau GmbH
Germany
22926
Layher GmbH
Germany
71737
LCD-Mikroelektronik GmbH
Germany
76185
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Productronica
News - 07.09.2008
Rework of QFN – no compromises
With the “Direct Component Printing (DCP) Module”, Finetech offers an all-in-one solution for all FINEPLACER rework stations. After the QFN component has been placed on the printing stencil using the FINEPLACER beam splitter optics, new solder paste can be applied consistently with a mini squeegee.
World Fab forecast projects over 20% in increase in fab spending in 2009
According to the World Fab Forecast report, recently released by SEMI, a projected decline in world semiconductor fab equipment spending of 20 percent is expected for 2008, but a rebound of over 20 percent in spending is expected in 2009, driven by over seventy fab projects. The August 2008 edition of the report lists 53 fab equipping projects and up to 21 construction projects for fabs in 2009.