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E
: (261 hits)
Company
Country
ZIP
EA Elektro-Automatik GmbH & Co.KG
Germany
41747
EAO Automotive GmbH & Co.KG
Germany
08209
EAO Lumitas GmbH
Germany
45277
EAO SECME GmbH
Germany
82024
Ease House Ltd
Hongkong
eASIC
USA
Easy Magnet Corp.
Taiwan
221
Easy Products, S.L.
Spain
28031
Eaton Electrical VCBU
Netherlands
7559 SC
EAW Relaistechnik GmbH
Germany
10317
Eazix Inc.
Phillipines
1770
Eazix Inc.
Phillipines
1770
eBay GmbH
Germany
14532
EBB Laser & Electronics GmbH
Germany
78476
EBE Elektro-Bau-Elemente GmbH
Member of the EBE Group
Germany
70771
EBG-Resistors
Austria
8082
ebm-papst Mulfingen GmbH & Co.KG
Germany
74673
ebm-papst St. Georgen
GmbH & Co.KG
Germany
78112
EBV Elektronik GmbH & Co.KG
Germany
85586
E-Call Enterprise Co.Ltd.
Taiwan
115
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News - 16.10.2008
IMEC demonstrates 3D stacked integrated circuits
IMEC announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5µm Cu through-silicon vias (TSV). It will now further develop 3D SIC chips on 200mm and 300mm wafers, integrating test circuits from partners participating in its 3D integration research program.
Worldwide semiconductor capital equipment spending to decline 26 Percent in 2008
A collapse in memory spending, combined with a weak economy, is driving a major contraction in semiconductor capital equipment spending in 2008, according to Gartner, Inc. The slowdown is expected to continue into 2009 before the industry recovers in 2010.