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News - 05.09.2008
Rework of QFN – no compromises
With the “Direct Component Printing (DCP) Module”, Finetech offers an all-in-one solution for all FINEPLACER rework stations. After the QFN component has been placed on the printing stencil using the FINEPLACER beam splitter optics, new solder paste can be applied consistently with a mini squeegee.
World Fab forecast projects over 20% in increase in fab spending in 2009
According to the World Fab Forecast report, recently released by SEMI, a projected decline in world semiconductor fab equipment spending of 20 percent is expected for 2008, but a rebound of over 20 percent in spending is expected in 2009, driven by over seventy fab projects. The August 2008 edition of the report lists 53 fab equipping projects and up to 21 construction projects for fabs in 2009.
Interconnection components
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