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AUTOMOTIVE INNOVATION

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ANALYSIS-MARKET-TRENDS - ecs: Price reductions significantly slowing down
Trend for automotive electronics prices changes

The analysis of price developments for automotive electronic components shows: the times of price reductions over the whole range of electronic devices have come to an end. Rising energy and raw material cost finally also have their impact in electronics.

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PRODUCT INNOVATIONS

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National Semiconductor - LVDS
Industry’s first AEC-Q100 compliant LVDS crosspoint switches, drivers and receivers

MOST Cooperation - automotive Ethernet
Automotive-ready physical layer for Ethernet in the car

Delphi - cable
Halogen-free ultra-thin-wall cable for multiple vehicles

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ANALYSIS-MARKET-TRENDS

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IMS Research - Report
Growth in the market for automotive sensors

IMS Research - report
Is it boom time for automotive electronics in India?

iSuppli warns:
U.S. falling behind in eco-friendly car electronics

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NEWS

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electronica automotive conference:
Secure early booking prices now for the expert forum on automobile electronics

Joint research project started
BMZ, University of Applied Sciences Aschaffenburg and Linde develop energy storage system for electric vehicles

Cars that talk
Commission earmarks single radio frequency for road safety and traffic management

Electronics in "Ultra Low Cost Cars"
Challenges and opportunities for suppliers of automotive electronics and semiconductors

automotive
Display challenges under control

automotive
Safety issues stimulate systems design approach

electronica 2008 - Automotive electronics in theory and practice
"electronica automotive conference" closely interlinked with leading international trade fair

TEG - thermoelectric generator
Electricity from the exhaust pipe

Specification Rev. 3.0 launched
MOST Cooperation specifies next generation infotainment backbone

Fraunhofer-Gesellschaft - EU project APROSYS
All-round safety

EU Project MERASA
New processors to make cars more economical and planes safer

EU - ESC avoids accidents
Electronic Stability Control to improve safety of trucks and coaches

MMI/ks
Intelligent cars: Commission leads the drive for safer, greener and smarter cars

MMI/ks
Infineon outperforms auto electronics market by 44%

MMI/ks
Siemens sells automobile supplier business VDO to Continental for €11.4 billion

MMI/ks
STM and Istituto Superiore Mario Boella team up to qvercome electro-magnetic interference in automotive applications



	EVENTS

Munich International Congress Center (ICM)
electronica automotive conference 2008 with Experts from Leading International Companies

Booming market India
"Call for Presentations" for the Automotive Symposium running parallel to "electronicIndia 2008"

EMBEDDED SYSTEMS

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PRODUCT INNOVATIONS - Linear Technology - Hot Swap controller
Integrated 2Amp MOSFET & sense resistor provides compact hot swap solution

Linear Technology introduces the LTC4217, a 2A integrated Hot Swap controller for protecting low power boards with load supply voltages ranging from 2.9V to 26.5V. Like other Hot Swap devices, the LTC4217 allows a board to be safely inserted and removed from a live backplane by limiting the amount of inrush current to the load supply during power up.

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PRODUCT INNOVATIONS

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Curtiss-Wright Controls
New rugged single board computer

Epson Toyocom - oscillator
Low-jitter, low phase noise SAW oscillator supports for high-speed interfaces

Linear Technology - PMIC
Switch mode USB power manager, buck-boost, boost & dual buck regulator

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ANALYSIS-MARKET-TRENDS

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SIA - Worldwide sales of semiconductors
July chip sales up 7.6 percent Year-on-Year

IMS Research - Report
Medium voltage motor drives market grows rapidly as energy prices soar

Vishay Siliconix - MOSFETs
p-channel power MOSFETs in the PowerPAK SC-75

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NEWS

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Texas Instruments - embedded systems
Texas Instruments, a key member of the IEEE working group, announced that it is driving the ratification of the IEEE 1149.7 standard, a new two-pin test and debug interface standard that supports half the number of pins of the IEEE 1149.1 technology, allowing developers to easily test and debug products with complex digital circuitry, multiple CPUs and applications software in products such as mobile and handheld communication devices.

Online ticket registration for visitors to the electronica 2008
Be sure to get your entrance ticket now to benefit from attractive prices

International CEO Round Table during electronica 2008
What contribution is the semiconductor industry making to climate protection?

MICRONANO-SYSTEMS

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ANALYSIS-MARKET-TRENDS - iSuppli - Microelectromechanical Systems
Sensors take the growth baton in the global MEMS market

Driven by new demand from consumer electronics and wireless applications, the global market for Microelectromechanical Systems (MEMS) will expand to $8.8 billion in 2012, up from $6.1 billion in 2006, iSuppli Corp. predicts.

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PRODUCT INNOVATIONS

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STMicroelectronics and Debiotech
First prototypes of disposable insulin nanopump

STMicroelectronics - 3D orientation sensor
New 3D orientation sensor using robust MEMS technology

MMI/ks
New cost-optimized 3-axis accelerometer miniaturizes motion sensing

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ANALYSIS-MARKET-TRENDS

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micronano-systems
Multiple MEMS potential will provoke market explosion

MEMS-based oscillators
WTC says MEMS timing ready for prime time

Electronics.ca Publications - Nanotechnology
Global Market for Nanotechnology slated for high growth through 2013

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NEWS

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micronano-systems
Nano charges to rescue lithium

micronano-systems
Nanowires with large scale ambitions

University of Southampton (ECS) - Single-electron transistors
New high performance, low power sensor at nanoscale



	EVENTS

Thurs 19th March 2008, The Royal Society, London
3rd International Conference on Nanotechnology and Smart Textiles for Industry, Healthcare and Fashion

WIRELESS COMMUNICATION

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PRODUCT INNOVATIONS - Gleichmann - wireless communication
Adapter enables wireless data transfer in the frequency range of 5 to 10 GHz

NEC Electronics’ µPD720180A device wire adapter (DWA), which immediately broadens Gleichmann Electronics’ product portfolio, was specifically designed for wireless communication between Wireless USB 2.0 compatible PCs or other Wireless USB 2.0 host systems and compatible peripheral and multimedia devices.

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PRODUCT INNOVATIONS

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Gleichmann - NEC host controller
Wireless USB host controller enables wireless data transfer rates of up to 480 Mbits/s in a range of 3 meters

Rohde & Schwarz - mobile radio scanner
Universal mobile radio scanner for setting up and optimizing WiMAX networks

AnalogicTech - step-down converters
High voltage step-down converters boost power efficiency of networking, wireless LAN equipment

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ANALYSIS-MARKET-TRENDS

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Forward Concepts - new annual study
Cellular Handset & Chip Markets '08

iSuppli - wireless semiconductor market
Wireless semiconductors outgrow overall chip market in 2007

In-Stat - embedded Wi-Fi
Wi-Fi in Consumer Electronics: What Will the Future Bring?

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NEWS

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Wireless
Focus on best fit for ZigBee

Wireless
Hitting the wireless market running

Wireless
Adding a new dimension to wireless device packaging

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electronicIndia
September 02-05, 2008 link

electronicAsia
October 13-16, 2008 link

electronica
November 11-14, 2008 link

News - 05.09.2008

New rugged single board computer
Curtiss-Wright Controls Embedded Computing has announced the VPX3-127, a new Power Architecture-based 3U VPX (VITA 46) single board computer (SBC). The powerful, small form-factor VPX3-127 SBC is the latest addition to Curtiss-Wright´s extensive family of rugged VPX SBC and DSP engines, and brings the high-bandwidth, serial switched fabric support, and ESD protection benefits of the VPX board architecture to space and weight constrained 3U embedded applications.

Texas Instruments, a key member of the IEEE working group, announced that it is driving the ratification of the IEEE 1149.7 standard, a new two-pin test and debug interface standard that supports half the number of pins of the IEEE 1149.1 technology, allowing developers to easily test and debug products with complex digital circuitry, multiple CPUs and applications software in products such as mobile and handheld communication devices.
Texas Instruments, a key member of the IEEE working group, announced that it is driving the ratification of the IEEE 1149.7 standard, a new two-pin test and debug interface standard that supports half the number of pins of the IEEE 1149.1 technology, allowing developers to easily test and debug products with complex digital circuitry, multiple CPUs and applications software in products such as mobile and handheld communication devices.

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