ALD Anlage, QUARZROHR-PROZESSÖFEN mit schnellen Rampen, geringer Platzbedarf, VAKUUM-LÖTANLAGEN, RTA/RTP, LTCC-Sinter-OFEN/PRESSE, HEIZPLATTEN, Diamant-RITZER, manueller Chip-Positionierer/BOND-KRAFT-TESTER
ALD system, QUARTZ TUBE PROCESS FURNACES: 1150°C, bench top: 1 m², fast ramping, multi purpose, up to 300 mm Ø, 50 x 200 mm, for LPCVD: epi, Carbon Nano Tubes, poly Si, Si3N4, ZrO2, SiO2, TEOS, , thermal SiO2, Polyimide, SiAu alloying, HSQ, H2/vacuum/N2/Ar annealing, wafer bump reflow, thick film paste firing, VACUUM REFLOW SOLDER OVENS: void free, flux less or with paste, wafer bump reflow, flip chip/die attach, lid sealing, alloying, RTA/RTP: 50°C/sec, 1100°C, 200 mm, LTCC SINTERING PRESS: 1100°C, 50 kN, HOT PLATES/CHUCKS, 450°C, DIAMOND SCRIBERS-manual-DIE BONDER/PULL TESTER |
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